Environmentally friendly soldering materials "Next Generation Surface Mount Solder Paste" + Equipment "Lead-Free Solder Compatible Eco Reflow Oven"
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
**Eco Solder Paste S70G** The lead-free solder paste "Eco Solder Paste" is a next-generation environmentally friendly solder paste that resolves issues associated with lead-free conversion, such as storage stability, supply stability, wettability, and heat resistance due to high melting points, compared to conventional solder pastes. □ Features - Maintains viscosity stability through storage and squeegeeing like conventional products - Improved heat resistance, reduced flux scattering, and enhanced reliability - Comprehensive improvement in mounting quality and productivity - Significantly improves suppression of BGA fusion defects - Increased direct electrical inspection post-mounting (Compared to our conventional products) **Lead-Free Solder Compatible Eco Reflow Oven SNR-825** Equipped with a Dragon Blow System and the latest flux recovery mechanism! Achieves high-quality soldering in lead-free applications. □ Features - Ultra-low ΔT achieved with the newly developed Dragon Blow System - Allows for temperature settings per heater, enabling high flexibility in profiles - Standard equipped with the latest flux recovery mechanism, resulting in almost no stickiness inside the oven - Maintains an oxygen concentration of 500 ppm or less inside the oven with a highly airtight muffle structure - Energy-saving due to high-efficiency insulation structure - Achieves high-quality soldering
- Company：千住金属工業
- Price：Other
